Chapter
Apr 26, 2012
Microsensor Packaging for High Temperature and Harsh Environment Applications
Authors: A. Friedberger and A. FourrierAuthor Affiliations
Publication: Engineering, Construction, and Operations in Challenging Environments: Earth and Space 2004
Abstract
This article describes the development of a high temperature and harsh environment compatible packaging solution for microsensors. It is based on the stacking of different layers with matched coefficients of thermal expansion. Careful selection of solder materials with appropriate soldering temperatures allow assembly of the sensor element and the complete stack housing with only two main soldering steps. Testing the sensor and comparing the results with a reference sensor demonstrated the potential of the developed concept.
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Published In
Engineering, Construction, and Operations in Challenging Environments: Earth and Space 2004
Pages: 139 - 144
Copyright
© 2004 American Society of Civil Engineers.
History
Published online: Apr 26, 2012
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Authors
Affiliations
A. Friedberger
EADS — European Aeronautic, Defense & Space Company, Corporate Research Center (CRC), Microsystems & Electronics, LG-ME, 81663 Munich, Germany
A. Fourrier
Thales Avionics, 25 rue Jules Védrines, 26027 Valence Cedex, France
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ASCE Library Cards let you download journal articles, proceedings papers, and available book chapters across the entire ASCE Library platform. ASCE Library Cards remain active for 24 months or until all downloads are used. Note: This content will be debited as one download at time of checkout.
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