Electrical Analysis of Smart Film-Based Crack-Width Monitoring in Bridge Infrastructure System
Publication: Journal of Infrastructure Systems
Volume 22, Issue 1
Abstract
A crack monitoring method based on a smart film crack sensor was proposed by the authors to monitor different characteristics of cracks such as initiation time, length, propagation, shape, and location. However, in engineering practice, data changes frequently after running for about half a year; it does not appear in the earlier period. Aiming at the problem, this paper focuses on electrical analysis in smart film crack monitoring. It is found that coupling capacitance increases with dielectric constant of enameled wire of the sensor, thus leading to the increase of coupling voltage and affecting the judgment. Therefore, a model is formulated to infer the relationship among the frequency of detecting signal, parasitic capacitance, and coupling interference voltage. On this basis, a smart film crack sensor is redesigned and the anti-interference circuit is added to hardware; the low-frequency detecting signal and the custom judgment mechanism are adopted to lower coupling voltage in the software. In consideration of improving the reliability of data transmission, a check mechanism is employed. Meanwhile, the improved sensor is testified to by experiments and applied to Chongqing Lijiatuo Yangtze River Bridge.
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Acknowledgments
This work is jointly supported by the Program for Innovation Team Building at Institutions of Higher Education in Chongqing (KJTD201306), the National Natural Science Foundations of China (No.61304175), the Scientific Research Foundation of Chongqing Education Commission (kj1400329), Natural Science Foundation Project of CQ (cstc2011jjA30010), the National Engineering Research Center for Inland Waterway Regulation (SLK2014B05). The authors give thanks to Minfeng Qiu for his help in translation and data collation.
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© 2015 American Society of Civil Engineers.
History
Received: Oct 4, 2014
Accepted: May 19, 2015
Published online: Jul 28, 2015
Discussion open until: Dec 28, 2015
Published in print: Mar 1, 2016
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