Technical Papers
Jan 22, 2020

Hybrid Digital Image Correlation

Publication: Journal of Engineering Mechanics
Volume 146, Issue 4

Abstract

Digital image correlation (DIC) is a commonly used full-field technique for measuring surface deformations in experimental solid mechanics. It directly provides full-field displacements by comparing digital images of the speckle pattern subsets painted on a structure’s surface in the undeformed and deformed states, respectively. Although DIC measures displacements in solid structures, it is often necessary to determine the individual stress components for proper fatigue and failure analysis. Hybrid digital image correlation (hybrid-DIC) is an experimental-analytical approach where theoretical formulations are combined with DIC displacement data for the identification of the full-field stress components. The present paper demonstrates the ability in providing reliable full-field stresses in numerous two-dimensional (2D) plane stress engineering situations involving circular and irregular geometric discontinuities in isotropic or orthotropic composite materials. Hybrid-DIC’s main advantages are (1) it does not require the differentiation of measured displacements, and (2) it provides stresses at the edges of discontinuities, often the location of maximum stress magnitudes.

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Data Availability Statement

Some or all data, models, or code generated or used during the study are available from the corresponding author by request (MATLAB code and DIC raw data for Test scenario II).

References

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Published In

Go to Journal of Engineering Mechanics
Journal of Engineering Mechanics
Volume 146Issue 4April 2020

History

Received: Mar 8, 2019
Accepted: Jul 23, 2019
Published online: Jan 22, 2020
Published in print: Apr 1, 2020
Discussion open until: Jun 22, 2020

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Authors

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Abdul Aziz Khaja, Ph.D.
Senior Manager, Applied Materials, Inc., 3050 Bowers Ave., P.O. Box 58039, Santa Clara, CA 95054-3299.
Associate Professor, Dept. of Mechanical and Industrial Engineering, Rochester Institute of Technology, Dubai Campus, Dubai, United Arab Emirates (corresponding author). ORCID: https://orcid.org/0000-0003-2041-0210. Email: [email protected]

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