Stress Concentration of a Microvoid Embedded in an Adhesive Layer during Stress Transfer
Publication: Journal of Engineering Mechanics
Volume 140, Issue 10
Abstract
This paper presents an elastic solution for one microvoid embedded in an adhesive layer close to a stiff bonding surface, which can be approximated as a semiinfinite domain with a fixed boundary. A Green’s function for a force in a semiinfinite solid with a fixed boundary condition is used to derive the stress field. By using the equivalent inclusion method, the microvoid has been replaced by the adhesive, but an eigenstrain is introduced to simulate the material mismatch. Through the stress equivalent condition, the eigenstrain is solved, and the stress concentration caused by the microvoid is evaluated considering the stress transfer caused by shear and tensile forces. A uniform normal stress and uniform shear stress are applied in the far field. The formulation is verified with finite-element simulation and can be extended to the case of multiple microvoids.
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Acknowledgments
This work is sponsored by the National Science Foundation (CMMI 0954717), whose support is gratefully acknowledged. H. M. Yin is also grateful to Professors Frank DiMaggio and Rene B. Testa for valuable discussion about the Rongved’s solution and the Mindlin’s problem. In addition, H. M. Yin appreciates the support of the Henry Mitchell Weitzner Research Fund, which has been and will be used in his research of roofing materials for solar energy applications and technologies.
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Published In
Journal of Engineering Mechanics
Volume 140 • Issue 10 • October 2014
Copyright
© 2014 American Society of Civil Engineers.
History
Received: Oct 13, 2013
Accepted: Feb 20, 2014
Published online: Mar 28, 2014
Discussion open until: Aug 28, 2014
Published in print: Oct 1, 2014
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