Dimethyl Sulfoxide Separating Waste Printed Circuit Boards by Dissolving Polymer Materials
Publication: Journal of Environmental Engineering
Volume 139, Issue 8
Abstract
The separation of waste printed circuit boards (WPCB) has been a bottleneck in WPCB resource processing. In this study, the separation of WPCBs was performed using dimethyl sulfoxide (DMSO) as a solvent by dissolving polymer materials. Waste printed circuit boards of in size were placed in DMSO at 60°C for 45 min. A metallographic microscope verified that the WPCBs produced the delamination. When the incubation time was increased from 45 to 210 min, polymer materials in WPCBs were dissolved by DMSO, and copper foils and glass fibers in WPCBs were separated completely. When the size of the WPCBs was increased from 1–1.5 to , the temperature of separating completely the copper foils and glass fibers in WPCBs increased from 60 to 90°C, but the separating time decreased from 210 to 90 min. The liquid photo solder resists (LPSR) were still adhered to the copper foils. The used DMSO was treated by rotary decompression evaporation, and the regenerated DMSO and solid residues were obtained. This new technology offers a new way to separate valuable materials from WPCBs.
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Acknowledgments
The authors are grateful for support of the key subject of Shanghai Municipality (S30109) and Shanghai Science and Technology Commission (10dz1205302).
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Information & Authors
Information
Published In
Journal of Environmental Engineering
Volume 139 • Issue 8 • August 2013
Pages: 1128 - 1131
Copyright
© 2013 American Society of Civil Engineers.
History
Received: May 7, 2012
Accepted: Mar 4, 2013
Published online: Mar 6, 2013
Published in print: Aug 1, 2013
Discussion open until: Aug 6, 2013
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