TECHNICAL PAPERS
Mar 14, 2003

Examination of Bulge Test for Determining Residual Stress, Young’s Modulus, and Poisson’s Ratio of 3C-SiC Thin Films

Publication: Journal of Aerospace Engineering
Volume 16, Issue 2

Abstract

Despite great advancements in thin-film growth and deposition techniques, determination of the residual stress and Young’s modulus for thin films has continued to be a challenge. The bulge test is a potentially powerful tool for characterizing these mechanical properties but is underutilized because of its sensitivity to experimental error. The bulge test is highly sensitive to sample and test preparation, accuracy of the deflection measurement, accuracy in the measurement of film dimensions, and selection of the correct equation to be used for extraction of the Young’s modulus and residual stress. In this study, effort has been made to consolidate the findings from various reports in the literature, and a thorough error analysis has been conducted. A discussion on the experimental technique used to extract Poisson’s ratio from the bulge test is also presented. Finally, the technique is used to determine the residual stress and Young’s modulus of 3C-SiC thin films grown on silicon.

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Go to Journal of Aerospace Engineering
Journal of Aerospace Engineering
Volume 16Issue 2April 2003
Pages: 46 - 54

History

Received: Nov 27, 2002
Accepted: Nov 27, 2002
Published online: Mar 14, 2003
Published in print: Apr 2003

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Authors

Affiliations

Jay S. Mitchell
PhD Precandidate, Dept. of Mechanical Engineering, Univ. of Michigan, 2250 G.G. Brown, 2350 Hayward, Ann Arbor, MI 48109-2125.
Christian A. Zorman
Dept. of Electrical Engineering and Computer Science, Case Western Reserve Univ., 10900 Euclid Ave., Cleveland, OH 44106.
Thomas Kicher
Dept. of Mechanical Engineering, Univ. of Michigan, 2250 G.G. Brown, 2350 Hayward, Ann Arbor, MI 48109-2125.
Shuvo Roy
Dept. of Electrical Engineering and Computer Science, Case Western Reserve Univ., 10900 Euclid Ave., Cleveland OH 44106. Current address: Dept. of Biomedical Engineering, The Cleveland Clinic Foundation, Cleveland OH 44195.
Mehran Mehregany
BFGoodrich Professor of Engineering Innovation, Dept. of Electrical Engineering and Computer Science, Bingham Bldg, Room 118, Case Western Reserve Univ., 10900 Euclid Avenue, Cleveland, OH 44106 (corresponding author).

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