Partially Bonded Bimaterial Plane Under Tension
Publication: Journal of Engineering Mechanics
Volume 116, Issue 9
Abstract
A bimaterial problem is considered for shapes that are symmetrical with respect to an interface that is finite and straight. A rational mapping function and complex stress functions are used to obtain a general solution for bonded half‐planes with cracks at an end of the interface. A stress analysis is carried out for a state of uniform tension at infinity, which is either symmetrical or antisymmetrical with respect to the interface. Stress distributions and stress‐intensity factors are obtained for various crack length and elastic constants. When one material is in tension and the other is free from traction, stress‐intensity factors are also investigated. The bond effects on the stress‐intensity factors are studied. The elastic constant's effects on the stress‐intensity factor for a short crack and the stress function for special material constants are also investigated.
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Published In
Journal of Engineering Mechanics
Volume 116 • Issue 9 • September 1990
Pages: 2017 - 2034
Copyright
Copyright © 1990 ASCE.
History
Published online: Sep 1, 1990
Published in print: Sep 1990
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