Identifying a Design Management Package to Support Concurrent Design in Building Wafer Fabrication Facilities
Publication: Journal of Construction Engineering and Management
Volume 132, Issue 6
Abstract
Concurrent design is commonly used in building a semiconductor wafer fabrication facilities to shorten projects. Current practice in managing a design schedule involves preset milestones that represent percentages of completion. Such a simple control scheme does not provide sufficient information to support concurrent design. This study presents an analytical model that applies a cluster identification algorithm to separate the work of designing a multisystem project into management packages that support concurrent design. Tasks within a package have strong informational dependency relationships on each other, and are not suited for concurrent design. Tasks of different packages have weak dependency relationships on each other, and are suited for concurrent design. Tendering design work based on these packages may reduce the number of design interfaces between participating design firms. Possible application of the model includes the management of design schedule, design contract tendering, and design information flow.
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Acknowledgments
The author would like to thank his colleague, Professor W. C. Wang, for his inspiration and input to this research. The following are also appreciated for their participation in our interviews and verification of the case demonstration: C. T. Huang, C. H. Wu, and L. S. Chen (Vice Presidents); Y. P. Hung and W. M. Chen (Directors); S. L. Chiang, C. K. Tang, and S. Y. Yu (Section Managers) at J. J. Pan and Partners, Architects and Planners; and also W. C. Chang (Director), Y. J. Chen, W. C. Tsai, and S. C. Fang (Engineers) at Powerchip Semiconductor Corporation. The writer’s graduate student, S. M. Hsieh, is also appreciated for his diligent efforts in coordinating and recording these activities.
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Information & Authors
Information
Published In
Journal of Construction Engineering and Management
Volume 132 • Issue 6 • June 2006
Pages: 606 - 614
Copyright
© 2006 ASCE.
History
Received: Jun 3, 2003
Accepted: Jun 22, 2005
Published online: Jun 1, 2006
Published in print: Jun 2006
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