Performance Characteristics of Diluted Epoxy Asphalt Binders and Their Potential Application in Chip Seal
Publication: Journal of Materials in Civil Engineering
Volume 31, Issue 12
Abstract
Epoxy asphalt is a thermosetting paving material that can provide higher strength, stiffness, adhesion, high-temperature stability, and service life compared to conventional asphalt; however, it has not been widely used on highway pavements, primarily due to the higher initial cost and limited operational window. In this paper, dilution of epoxy asphalt with styrene-butadiene-styrene (SBS)-modified asphalt was studied for the potential use in chip seal applications. Performance characteristics such as workability, hardening process, uncured and fully cured bond strength, and fully cured binder performance in both high and low temperatures were also investigated thoroughly. It was found that the SBS-modified asphalt has a higher initial adhesion feature and can help provide a quicker opening to traffic after construction than the undiluted epoxy asphalt. Meanwhile, epoxy asphalt binder in the blend can enhance the final adhesive strengths to retain the chips under strain induced by vehicles in the long term. The dilution level in and ratios showed a faster polymerization/curing rate than the and ratios. Diluted epoxy asphalt also showed improved low-temperature performance compared to undiluted epoxy asphalt and better high-temperature performance compared to pure SBS-modified asphalt. Overall, this paper presents that dilution of epoxy asphalt with SBS-modified asphalt could have significant practical benefits, and the dilution ratio seems to be the most suitable from the aspects of performance, cost, and practical use.
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Acknowledgments
This work is supported by the National Natural Science Foundation of China (No. 51208103) and Jiangsu provincial department of education.
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Published In
Journal of Materials in Civil Engineering
Volume 31 • Issue 12 • December 2019
Copyright
©2019 American Society of Civil Engineers.
History
Received: Feb 10, 2019
Accepted: Jun 7, 2019
Published online: Sep 19, 2019
Published in print: Dec 1, 2019
Discussion open until: Feb 19, 2020
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