Simplified Impedance Model for Adhesively Bonded Piezo-Impedance Transducers
Publication: Journal of Aerospace Engineering
Volume 22, Issue 4
Abstract
The electromechanical impedance technique employs surface-bonded lead zirconate titanate piezoelectric ceramic patches as impedance transducers for structural health monitoring and nondestructive evaluation. The patches are bonded to the monitored structures using finitely thick adhesive bond layer, which introduces shear lag effect, thus invariably influencing the electromechanical admittance signatures. This paper presents a new simplified impedance model to incorporate shear lag effect into electromechanical admittance formulations, both one-dimensional and two-dimensional. This provides a closed-form analytical solution of the inverse problem, i.e. to derive the true structural impedance from the measured conductance and susceptance signatures, thus an improvement over the existing models. The influence of various parameters (associated with the bond layer) on admittance signatures is investigated using the proposed model and the results compared with existing models. The results show that the new model, which is far simpler than the existing models, models the shear lag phenomenon reasonably well besides providing direct solution of a complex inverse problem.
Get full access to this article
View all available purchase options and get full access to this article.
References
Adams, R. D., and Wake, W. C. (1984). Structural adhesive joints in engineering, Elsevier Applied Science Publishers, London.
Annamdas, V. G. M., and Soh, C. K. (2007a). “Three-dimensional electromechanical impedance model: Formulation of directional sum impedance.” J. Aerosp. Eng., 20(1), 53–62.
Annamdas, V. G. M., and Soh, C. K. (2007b). “An electromechanical impedance model of a piezoceramic transducer-structure in the presence of thick adhesive bonding.” Smart Mater. Struct., 16(3), 673–686.
Bhalla, S., and Soh, C. K. (2003). “Structural impedance based damage diagnosis by piezo-transducers.” Earthquake Eng. Struct. Dyn., 32(12), 1897–1916.
Bhalla, S., and Soh, C. K. (2004a). “Structural health monitoring by piezo-impedance transducers. I: Modeling.” J. Aerosp. Eng., 17(4), 154–165.
Bhalla, S., and Soh, C. K. (2004b). “Structural health monitoring by piezo-impedance transducers. II: Applications.” J. Aerosp. Eng., 17(4), 166–175.
Bhalla, S., and Soh, C. K. (2004c). “Impedance based modeling for adhesively bonded piezo-transducers.” J. Intell. Mater. Syst. Struct., 15(12), 955–972.
Crawley, E. F., and de Luis, J. (1987). “Use of piezoelectric actuators as elements of intelligent structures.” AIAA J., 25(10), 1373–1385.
Giurgiutiu, V. and Zagrai, A. N. (2002). “Embedded self-sensing piezoelectric active sensors for on-line structural identification.” ASME J. Vibr. Acoust., 124(1), 116–125.
IEEE. (1987). “IEEE standard on piezoelectricity.” IEEE 176.
Liang, C., Sun, F. P., and Rogers, C. A. (1994). “Coupled electro-mechanical analysis of adaptive material systems-determination of the actuator power consumption and system energy transfer.” J. Intell. Mater. Syst. Struct., 5, 12–20.
Ong, C. W., Yang, Y., Wong, Y. T., Bhalla, S., Lu, Y., and Soh, C. K. (2002). “The effects of adhesive on the electro-mechanical response of a piezoceramic transducer coupled smart system.” Proc., ISSS-SPIE Int. Conf. on Smart Materials, Structures and Systems, ISSS, Bangalore, 191–197.
Park, G., Cudney, H. H., and Inman, D. J. (2000). “Impedance-based health monitoring of civil structural components.” J. Infrastruct. Syst., 6(4), 153–160.
Park, S., Yun, C. -B., Roh, Y., and Lee, J. -J. (2006). “PZT-based active damage detection techniques for steel bridge components.” Smart Mater. Struct., 15(4), 957–966.
Qing, X. P., Chan, H. -L., Beard, S. J., Ooi, T. K., and Marotta, S. A. (2006). “Effect of adhesive on performance of piezoelectric elements used to monitor structural health.” Int. J. Adhes. Adhes., 26(8), 622–628.
Sirohi, J., and Chopra, I. (2000). “Fundamental understanding of piezoelectric strain sensors.” J. Intell. Mater. Syst. Struct., 11(4), 246–257.
Soh, C. K., Tseng, K. K.-H., Bhalla, S., and Gupta, A. (2000). “Performance of smart piezoceramic patches in health monitoring of a RC bridge.” Smart Mater. Struct., 9(4), 533–542.
Sun, F. P., Chaudhry, Z., Rogers, C. A., Majmundar, M., and Liang, C. (1995). “Automated real-time structure health monitoring via signature pattern recognition.” Proc., SPIE Conf. on Smart Structures and Materials, SPIE, San Diego, 2443, 236–247.
Xu, Y. G., and Liu, G. R. (2002). “A modified electro-mechanical impedance model of piezoelectric actuator-sensors for debonding detection of composite patches.” J. Intell. Mater. Syst. Struct., 13(6), 389–396.
Zhou, S. W., Liang, C., and Rogers, C. A. (1996). “An impedance-based system modeling approach for induced strain actuator-driven structures.” ASME J. Vibr. Acoust., 118(3), 323–331.
Information & Authors
Information
Published In
Copyright
© 2009 ASCE.
History
Received: Nov 7, 2007
Accepted: Jan 22, 2009
Published online: Sep 15, 2009
Published in print: Oct 2009
Authors
Metrics & Citations
Metrics
Citations
Download citation
If you have the appropriate software installed, you can download article citation data to the citation manager of your choice. Simply select your manager software from the list below and click Download.