Integrated Microelectromechanical Gyroscopes
Publication: Journal of Aerospace Engineering
Volume 16, Issue 2
Abstract
Microelectromechanical (MEMS) gyroscopes have wide-ranging applications including automotive and consumer electronics markets. Among them, complementary metal-oxide semiconductor-compatible MEMS gyroscopes enable integration of signal conditioning circuitry, multiaxis integration, small size, and low cost. This paper reviews various designs and fabrication processes for integrated MEMS gyroscopes and compares their performance. Operational principles and design issues of MEMS vibratory gyroscopes are also addressed.
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References
Ayazi, F., and Najafi, K.(2001). “A HARPSS polysilicon vibrating ring gyroscope.” J. Microelectromech. Syst., 10(2), 169–179.
Baltes, H., Brand, O., Hierlemann, A., Lange, D., and Hagleitner, C. (2002). “CMOS MEMS—Present and future.” Proc., The Fifteenth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2002), Las Vegas, Jan. 20–24, 459–466.
Baltes, H., Paul, O., and Brand, O.(1998). “Micromachined thermally based CMOS microsensors.” Proc. IEEE, 86(8), 1660–1678.
Bernstein, J., Cho, S., King, A. T., Kourepenis, A., Maciel, P., and Weinberg, M. (1993). “A micromachined comb-drive tuning fork rate gyroscope.” Proc., 6th IEEE Int. Conf. on Microelectromechanical Systems, Fort Lauderdale, Fla., Feb. 7–10, 143–148.
Clark, W. A., Howe, R. T., and Horowitz, R. (1996). “Surface micromachined Z-axis vibratory rate gyroscope.” Technical Digest. Solid-State Sensor and Actuator Workshop, Hilton Head Island, S.C., June 3–6, Transducers Research Found., 283–287.
Core, T. A., Tsang, W. K., and Sherman, S. J.(1993). “Fabrication technology for an integrated surface-micromachined sensor.” Solid State Technol., 36(10), 39–47.
Fedder, G. K., Santhanam, S., Reed, M. L., Eagle, S. C., Guillou, D. F., Lu, M. S.-C., and Carley, L. R.(1996). “Laminated high-aspect-ratio microstructures in a conventional CMOS process.” Sens. Actuators A, A57(2), 103–110.
Franke, A. E., Bilic, D., Chang, D. T., Jones, P. T., King, T.-J., Howe, R. T., and Johnson, G. C. (1999). “Post-CMOS integration of germanium microstructures.” Proc., Twelfth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS ’99), Orlando, Fla., Jan. 17–21, 630–637.
Franke, A. E., Jiao, Y., Wu, M. T., King, T.-J., and Howe, R. T. (2000). “Post-CMOS modular integration of poly-SiGe microstructures using poly-Ge sacrificial layers.” Technical Digest IEEE Solid-State Sensor & Actuator Workshop, Hilton Head Island, S.C., June 4–8, Transducers Research Found., 18–21.
Funk, K., Emmerich, H., Schilp, A., Offenberg, M., Neul, R., and Larmer, F. (1999). “A surface micromachined silicon gyroscope using a thick polysilicon layer.” Proc., Twelfth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS ’99), Jan. 17–21, Orlando, Fla., 57–60.
Geen, J. A., Sherman, S. J., Chang, J. F., and Lewis, S. R. (2002). “Single-chip surface-micromachining integrated gyroscope with 50 deg/hour root Allan variance.” Digest of 2002 IEEE International Solid-State Circuits Conference, San Francisco Feb. 3–7, 426–427.
Greiff, P., Boxenhorn, B., King, T., and Niles, L. (1991). “Silicon monolithic micromechanical gyroscope.” Proc., IEEE 1991 Int. Conf. on Solid State Sensors and Actuators, San Francisco, June 24–27, 966–968.
He, G., and Najafi, K. (2002). “A single-crystal silicon vibrating ring gyroscope.” Proc., The Fifteenth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2002), Las Vegas, Jan. 20–24, 718–721.
Hombersley, S. (2002). “BAE Systems and Segway LLC announce partnership to market Segway™ human transporter in the UK.” 〈http://www.baesystems.com/newsroom/2002/jul/220702news8.htm〉 (July 22, 2002).
Hopkin, I. D. (1994). “Vibrating gyroscopes (automotive sensors).” IEEE Colloquium on ‘Automative Sensors’ (Digest No. 1994/170), Sept. 13, Solihull, UK, 1–4.
IEEE Std 528-1994. (1994). “IEEE standard for inertial sensor technology.” The Institute of Electrical and Electronics Engineers, Inc., New York.
Jiang, X., Seeger, J. I., Kraft, M., and Boser, B. E. (2000). “A monolithic surface micromachined Z-axis gyroscope with digital output.” Digest of Technical Papers, 2000 Symposium on VLSI Circuits, June 15–17, Honolulu, 16–19.
Juneau, T., Pisano, A. P., and Smith, J. H. (1997). “Dual axis operation of a micromachined rate gyroscope.” Proc., IEEE 1997 Int. Conf. on Solid State Sensors and Actuators (Tranducers ’97), Chicago, June 16–19, 883–886.
Kurosawa, M., Fukuda, Y., Takasaki, M., and Higuchi, T.(1998). “A surface-acoustic-wave gyro sensor.” Sens. Actuators A, A66(1–3), 33–39.
Luo, H., Zhu, X., Lakdawala, H., Carley, L. R., and Fedder, G. K. (2002). “A copper CMOS-MEMS z-axis gyroscope.” Proc., The Fifteenth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2002), Las Vegas, Jan. 21–25, 631–634.
Lutz, M., Golderer, W., Gerstenmeier, J., Marek, J., Maihofer, B., Mahler, S., Munzel, H. and Bischof, U. (1997). “A precision Yaw Rate Sensor in Silicon Micromachining.” Proc., IEEE 1997 Int. Conf. on Solid State Sensors and Actuators, Chicago, June 16–19, 847–850.
Maenaka, T., Konishi, K., Fujita, Y., and Maeda, M. (1995). “Analysis of a highly sensitive silicon gyroscope with cantilever beam as vibrating mass.” Digest, The Eighth IEEE Int. Conf. on Solid-State Sensors and Actuators and Eurosensors IX. June 25–29, Stockholm, Sweden, 612–615.
Mochida, Y., Tamura, M., and Ohwada, K. (1999). “A micromachined vibrating rate gyroscope with independent beams for the drive and detection modes.” Proc., Twelfth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS ’99), Orlando, Fla., Jan. 17–21, 618–623.
Park, K. Y., Jeong, H. S., An, S., Shin, S. H., and Lee, C. W. (1999). “Lateral gyroscope suspended by two gimbals through high aspect ratio ICP etching.” Proc., IEEE 1999 Int. Conf. on Solid State Sensors and Actuators (Tranducers ’99), Sendai, Japan, June 7–10, 972–975.
Park, K. Y., Lee, C. W., Oh, Y. S., and Cho, Y. H. (1997). “Laterally oscillated and force-balanced micro vibratory rate gyroscope supported by fish hook shape springs.” Proc., Tenth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS ’97), Nagoya, Japan, Jan. 26–30, 494–499.
Payne, R. S., Sherman, S., Lewis, S., and Howe, R. T. (1995). “Surface micromachining: From vision to reality to vision (accelerometer).” Digest of Technical Papers, 1995 IEEE Int. Solid-State Circuits Conf. (ISSCC ’95), Feb. 15–17, San Francisco, 164–165.
Putty, M. W., and Najafi, K. (1994). “A micromachined vibrating ring gyroscope.” Technical Digest, Solid-State Sensor and Actuator Workshop, Hilton Head Island, S.C., June 13–16, Transducers Research Found., 213–220.
Seshia, A. A., Howe, R. T., and Montague, S. (2002). “An integrated microelectromechanical resonant output gyroscope.” Proc., The Fifteenth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2002), Las Vegas, Jan. 21–25, 722–726.
Shearwood, C., Williams, C. B., Mellor, P. H., Yates, R. B., Gibbs, M. R. J., and Mattingley, A. D.(1995). “Levitation of a micromachined rotor for application in a rotating gyroscope,” Electron. Lett., 31(21), 1845–1846.
Smith, J. H., Montague, S., Sniegowski, J. J., and Murray, J. R. et al. (1995). “Embedded micromechanical devices for the monolithic integration of MEMS with CMOS.” Proc., Int. Electron Devices Meeting, Washinton, DC, Dec. 10–13, 609–619.
Sparks, D., Slaughter, D., Beni, R., Jordan, L., Chia, M., Rich, D., Johnson, J., and Vas, T.(1999). “Chip-scale packaging of a gyroscope using wafer bonding,” Sens. Mater., 11(4), 97–207.
Tanaka, K., Mochida, Y., Sugimoto, S., Moriya, K., Hasegawa, T., Atsuchi, K., and Ohwada, K. (1995). “A micromachined vibrating gyroscope,” Proc., Eighth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS ’95), Amsterdam, Netherlands; 29 Jan.–2 Feb., 278–281.
Tang, T. K., Gutierrez, R. C., Stell, C. B., Vorperian, V., Arakaki, G. A., Rice, J. T., Li, W. J., Chakraborty, I., Shcheglov, K., Wilcox, J. Z., and Kaiser, W. J. (1997). “A packaged silicon MEMS vibratory gyroscope for microspacecraft.” Proc., Tenth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS ’97), Nagoya, Japan, Jan. 26–30, 500–505.
Wisniowski H. (2002). “Analog Devices introduces world’s first integrated gyroscope.” 〈http://www.analog.com/technology/mems/gyroscopes〉 (October 1, 2002).
Xie, H. (2002). “Gyroscope and Micromirror Design Using Vertical-Axis CMOS-MEMS Actuation and Sensing.” PhD thesis, Carnegie Mellon Univ., Pittsburgh, Pa., 2002.
Xie, H., Erdmann, L., Zhu, X., Gabriel, K., and Fedder, G. K.(2002a). “Post-CMOS Processing For High-aspect-ratio Integrated Silicon Microstructures.” J. Microelectromech. Syst., 11(2), 93–101.
Xie, H., and Fedder, G. K. (2001). “A CMOS-MEMS Lateral-axis Gyroscope.” Proc., The Fourteenth IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2001), Interlaken, Switzerland, January 21–25, 162–165.
Xie, H., and Fedder, G. K. (2002a). “A DRIE CMOS-MEMSGyroscope.” IEEE Sensors 2002 Conf. June 12–14, Orlando, Fla.
Xie, H., and Fedder, G. K.(2002b). “Vertical Comb-finger Capacitive Actuation and Sensing for CMOS-MEMS,” Sens. Actuators A, A95(2–3), 212–221.
Xie, H., Fedder, G. K., Pan, Z., and Frey, W.(2002b). “Phase and vibration analysis for a CMOS-MEMS gyroscope.” Int. J. Nonlinear Sciences Numerical Simulation, 3(3–4), 319–324.
Yun, W., Howe, R. T., and Gray, P. R. (1992). “Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry.” Technical Digest IEEE Solid-State Sensor & Actuator Workshop, Hilton Head Island, S.C., June 22–25, Transducer Research Foundation, 126–131.
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Copyright © 2003 American Society of Civil Engineers.
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Received: Nov 27, 2002
Accepted: Nov 27, 2002
Published online: Mar 14, 2003
Published in print: Apr 2003
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