TECHNICAL PAPERS
Feb 1, 2001
Adhesive Contact between a Rigid Punch and a Half-Plane via a Thin, Soft Interlayer
Authors: M. I. Porter and D. A. HillsAuthor Affiliations
Publication: Journal of Engineering Mechanics
Volume 127, Issue 2
Abstract
The contact pressure arising when a flat-ended punch is loaded against an elastic half-plane with a thin, rigid-ideally plastic interlayer is found under adhesive conditions. Slip line field theory is employed, and the local stress state in the substrate deduced in order to assess the brittle fracture strength of the material beneath the contact.
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References
1.
Kelly, P., Hills, D. A., and Nowell, D. ( 1992). “Models for plastic constraint in brazed or diffusion-bonded joints between ceramic components.” Acta Metall. Mat., 40(9), 2149–2154.
2.
Johnson, W., and Mellor, P. B. ( 1962). Plasticity for mechanical engineers, D. Van Nostrand Co., Ltd., London.
3.
Alexander, J. M. ( 1955). “The effect of Coulomb friction in the plane-strain compression of a plastic-rigid material.” J. Mech. Phys. Solids, 3, 233–245.
4.
Hills, D. A., Nowell, D., and Sackfield, A. ( 1993). Mechanics of elastic contacts, Butterworth-Heinemann Ltd., Oxford, U.K.
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History
Received: Oct 13, 1999
Published online: Feb 1, 2001
Published in print: Feb 2001
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M. I. Porter
D. A. Hills
Res. Student, Dept. of Engrg. Sci., The University of Oxford, Parks Rd., Oxford, OX1 3PJ, U.K. E-mail: [email protected]
Prof., Dept. of Engrg. Sci., The University of Oxford, Parks Rd., Oxford, OX1 3PJ, U.K. E-mail: [email protected]
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Terms of Use: ASCE Library Cards are for individual, personal use only. Reselling, republishing, or forwarding the materials to libraries or reading rooms is prohibited.